TUTAMEN
A total solution
We design and manufacture advanced thermal management systems and precision mechanical hardware for the world's leading AI, hyperscale, and network security programmes. Engineered in America. Built at global scale.
WHY NOW
Frontier rack power density — kW per rack. Nvidia's roadmap reaches 600 kW by 2027 and a megawatt by 2028.
1 MW+
Per-rack power, Nvidia 800V architecture era (2028)
Rubin Ultra reaches 600 kW in 2027.
Source: NVIDIA GTC roadmap
4–5×
AI training compute, year-over-year
Source: Epoch AI
3×
Hyperscale capacity growth, 2024–2030
61% of global data-centre capacity by 2030.
Source: Synergy Research
~1.5%
Of global electricity went to data centres in 2024
Doubling to ~3% by 2030.
Source: IEA
150 kW+
Already beyond today's GB200/GB300 racks
And the micro-fin architecture scales as density climbs.
Source: Tutamen engineering
Tutamen is built to scale with that curve, not chase it.
Talk to Our EngineersHyperscale data centre operators running AI compute at scale
AI infrastructure teams deploying GPU and ASIC clusters above 30kW per rack
Server OEMs and system integrators needing one qualified thermal + mechanical supplier
Network security hardware companies requiring custom thermal solutions for mission-critical deployments
If your existing cooling solution is at its limit — or you need an engineering partner who can design, qualify, and manufacture at volume without handing the problem back — you are in the right place.
WHAT WE DO
Custom liquid cooling architecture for high-density rack deployments. Direct-to-chip cold plates, manifold systems, and micro-channel assemblies engineered for 150 kW+ rack densities. Proprietary IP in every programme.
See Solutions
Chassis rails, faceplates, EMI shielding — co-designed and co-CAD'd with the thermal platform. One supplier, one qualification. Everything But the Board.
See Solutions
Custom thermal pads, pastes, and gels. Tutamen's proprietary thermal interface materials — qualified in-house, long-lead friendly, and integrated with our thermal and mechanical stack for a true tip-to-tail solution.
See SolutionsCUSTOMER AWARDS
Palo Alto Networks: three years, three different award categories — relationship, quality, named distinction. Foxconn: back-to-back quality recognition from one of the most demanding contract manufacturers in the world.
Palo Alto Networks
The pinnacle of the PANW awards progression
Palo Alto Networks
Manufacturing execution recognition
Palo Alto Networks
Relationship strength recognition
Foxconn
Back-to-back recognition from the world's largest contract manufacturer
Foxconn
First-ever from Foxconn that validates our manufacturing standards at scale
Enovis
Medical platform recognition that proves diversification beyond AI compute is real
Pegatron
Track record predates the AI cycle — Tutamen has been earning customer recognition for years
Customers don't give multi-year, multi-category awards to vendors. They give them to platforms.
SOLUTIONS
Everything But the Board.
Tutamen engineers and manufactures the complete thermal and structural stack — from cold plate geometry through to deployment-ready rack assembly. Every programme begins with our engineering team. Every solution is built to perform at the densities AI infrastructure demands today and the densities it will demand tomorrow.
120–150kW racks (GB200 / GB300-class). Direct-to-chip cold plates, rack manifold systems, BMQC quick-connect infrastructure. Tutamen delivers the full liquid loop, designed and qualified as a system.
High-density inference with consistent sustained thermal performance. CFD-validated cold plate designs, full control manifold with integrated sensors and HMI.
Ruggedised or space-constrained. Custom-dimensioned heat sinks, vapour chambers, heat pipe assemblies. Prototype-to-production in a single supplier.
Dense, always-on hardware. Passive and air-cooled heat sinks, EMI-controlled chassis and faceplate assemblies. Complete mechanical and thermal stack, co-qualified, single sourced.
R&D & TESTING LABORATORIES
Established 2026
Dongguan, China
Development and testing of thermal infrastructure improvement innovations.
Established 2025
Dongguan, China
Thermal and electrically conductive pastes, gels, and pads. Brazing flux. Conductive plastics.
Planned 2027
Bay Area, California
Collaborative design and testing environment for all things thermal.
HOW WE WORK
Tell us your operating envelope: power dissipation, target temperatures, form factor, volume, timeline. Design to specification or design to drawing — we work both ways.
CFD modelling, DFM analysis, and materials selection against your parameters. You receive a validated thermal model — not a quotation based on assumptions — before any prototype is committed.
We build and test in our Thermal Laboratory using real load profiles: cartridge heaters, die simulators, thermocouple arrays, live board testing. Validated performance data before you commit to production.
Once locked, the design moves directly into our production infrastructure — China, Malaysia, Mexico — with the same engineering team owning quality and programme management through full lifecycle.
OUR FOOTPRINT
CERTIFICATIONS & AUDITS
CONTACT
Talk to our engineers about a new programme, a thermal challenge, or a manufacturing brief. We respond personally to every enquiry.
New programmes, DFM consultations, technical discussions.
Active programmes, partnership and investment discussions.
Prefer to chat? Click Get Connected above — our intake assistant will pre-qualify your enquiry and route it to the right team within one business day.
